| PART |
Description |
Maker |
| IDT72V273L7BC IDT72V273L7BCI IDT72V273L7PF IDT72V2 |
64K x 18 / 128K x 9 SuperSync II FIFO, 3.3V
32K x 18 / 64K x 9 SuperSync II FIFO, 3.3V
16K x 18 / 32K x 9 SuperSync II FIFO, 3.3V
8K x 18 / 16K x 9 SuperSync II FIFO, 3.3V
4K x 18 / 8K x 9 SuperSync II FIFO, 3.3V
2K x 18 / 4K x 9 SuperSync II FIFO, 3.3V
1K x 18 / 2K x 9 SuperSync II FIFO, 3.3V
512 x 18 / 1K x 9 SuperSync II FIFO, 3.3V
3.3 VOLT HIGH-DENSITY SUPERSYNC NARROW BUS FIFO
|
IDT
Integrated Device Technology
|
| GS840E36AGT-180I |
256K x 18, 128K x 32, 128K x 36 4Mb Sync Burst SRAMs 128K X 36 CACHE SRAM, 8 ns, PQFP100
|
GSI Technology, Inc.
|
| MCM63P818 MCM63P736 MCM63P736TQ100 MCM63P736ZP133R |
Circular Connector; Body Material:Aluminum; Series:PT07; No. of Contacts:2; Connector Shell Size:8; Connecting Termination:Solder; Circular Shell Style:Jam Nut Receptacle; Circular Contact Gender:Pin; Insert Arrangement:8-2
128K x 36 and 256K x 18 Bit Pipelined BurstRAM Synchronous Fast Static RAM 256K X 18 CACHE SRAM, 5 ns, PQFP100
128K x 36 and 256K x 18 Bit Pipelined BurstRAM Synchronous Fast Static RAM 128K X 36 CACHE SRAM, 4 ns, PBGA119
128K x 36 and 256K x 18 Bit Pipelined BurstRAM Synchronous Fast Static RAM 128K X 36 CACHE SRAM, 5 ns, PQFP100
Replaced by PTH12000W :
|
MOTOROLA INC
NEC, Corp.
Motorola Mobility Holdings, Inc.
Motorola, Inc.
|
| CYD02S36V CYD04S36V CYD09S36V CYD18S36V |
FLEx36TM 3.3V 32K/64K/128K/256K/512 x 36 Synchronous Dual-Port RAM(FLEx36TM 3.3V 32K/64K/128K/256K/512 x 36同步双端口RAM) FLEx36TM 3.3 32K/64K/128K/256K/512 × 36同步双口RAM（FLEx36TM 3.3 32K/64K/128K/256K/512 × 36同步双端口RAM）的
|
Cypress Semiconductor Corp.
|
| 256KX18 128KX36 IS61NVP25618A IS61NLP12832B-200B2 |
128K x 32, 128K x 36, and 256K x 18 STATE BUS SRAM
128K X 36 ZBT SRAM, 2.6 ns, PBGA119 14 X 22 MM, 1 MM PITCH, PLASTIC, BGA-119
128K X 36 ZBT SRAM, 2.6 ns, PBGA165 13 X 15 MM, 1 MM PITCH, PLASTIC, BGA-165
128K X 36 ZBT SRAM, 2.6 ns, PQFP100 TQFP-100
128K X 36 ZBT SRAM, 3.1 ns, PBGA119 14 X 22 MM, 1 MM PITCH, PLASTIC, BGA-119
128K X 36 ZBT SRAM, 3.1 ns, PBGA165 13 X 15 MM, 1 MM PITCH, PLASTIC, BGA-165
128K x 32, 128K x 36, and 256K x 18 4Mb, PIPELINE (NO WAIT) STATE BUS SRAM 256K X 18 ZBT SRAM, 3.1 ns, PBGA119
128K x 32, 128K x 36, and 256K x 18 4Mb, PIPELINE (NO WAIT) STATE BUS SRAM 256K X 18 ZBT SRAM, 3.1 ns, PQFP100
|
天津新技术产业园区管理委员会
Integrated Silicon Solution, Inc.
Integrated Silicon Solu...
|
| CY7C0837AV CY7C0837AV-133BBC CY7C0837AV-133BBI CY7 |
FLEx18垄芒 3.3V 64K/128K x 36 and 128K/256K x 18 Synchronous Dual-Port RAM
FLEx18 3.3V 64K/128K x 36 and 128K/256K x 18 Synchronous Dual-Port RAM
FLEx183.3V 64K/128K x 36 and 128K/256K x 18 Synchronous Dual-Port RAM
FLEx18?/a> 3.3V 64K/128K x 36 and 128K/256K x 18 Synchronous Dual-Port RAM
|
Cypress Semiconductor Corp.
http://
|
| IS61VPS12836A-250TQ IS61VPS12836A-250B3 IS61VPS128 |
128K x 32, 128K x 36, 256K x 18 4 Mb SYNCHRONOUS PIPELINED, SINGLE CYCLE DESELECT STATIC RAM
|
http://
Integrated Silicon Solu...
|
| GS840FH36AT-8I |
256K x 18, 128K x 32, 128K x 36 4Mb Sync Burst SRAMs
|
GSI Technology
|
| IDT72V36110L7.5PF V36100L6PF |
3.3 VOLT HIGH-DENSITY SUPERSYNC II36-BIT FIFO 128K X 36 OTHER FIFO, 5 ns, PQFP128
3.3 VOLT HIGH-DENSITY SUPERSYNC II??36-BIT FIFO
|
Integrated Device Technology, Inc.
INTEGRATED DEVICE TECHNOLOGY INC
|
|
